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Semiconductor Device

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HEATER CHAMBER MODULE
This is a test module for check the abnormality by temperature change of the wafer during transport and export in load-lock chamber.
제품소개
SPECIFICATIONS
Dimension 1500 x 850 x 850
Work Poly crystal / Single crystal Si board 300mm ±1.0 xt 0.15 ~ 2.0
Quarz Hand Loadage : 1 EA, Wafer angle : 3°, Pitch mm
Throughput
Wafer Cassete LSC - Pitch : 10 mm, 1 EA storage
TRC - Pitch : 10 mm, 1 EA storage
Pass Line Wafer in - 786 mm (supply or emmision system)
Wafer hand in - 610 mm (adjustable)
Safety Interlock EMS Switch, Door Interlock
Control PLC control, Interface : MELSEC NET
Utility Main power : 208V, 3 phase, A
Air : ∅10 panel union type 1 port (5 kg/㎠) (Air : 1 Port)