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반도체 장비

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SEMI LPM MODULE
CE, S2 and SEMI compliant
RS-232 communication interface
FOUP presence and placement sensor with lamps
Wafer protrusion sensor
FOUP pinch point protection BEOL/FEOL lock out pin Compatiable with all SEMI compliant 300mm FOUP's Compatible with OHT, AGV material handling interface Module Design for quick service swap-outs Cleanliness of ISO class1 @ 0.1 micros High reliability
제품소개
SPECIFICATIONS
모델명 MLX-ST-1000
Wafer Size 300mm
Carrier Type 25 FOUP's
Dimension 472(W) x 493(D) x 1344.5(H)
Weight 60kg
Mounting Mounting point : 900mm ± 10mm
Bolting : ISO M8 - 6H
Cleanliness Class1 @ 0.1㎛
Electrical Interface + 24 VDC
Option RF ID Reader
PIO Sensor
Teaching pendent